来源:内容来自「ICCAD年会」,谢谢。
由中国半导体行业协会、“核高基”国家科技重大专项总体专家组、集成电路设计产业技术创新战略联盟、广东省工业和信息化厅、珠海市人民政府主办,中国半导体行业协会集成电路设计分会、珠海市科技和工业信息化局、上海芯媒会务服务有限公司、上海亚讯商务咨询有限公司协办,珠海市软件行业协会集成电路设计分会、中国通信学会通信专用集成电路委员会、《中国集成电路》杂志社共同承办的“中国集成电路设计业2018年会暨珠海集成电路产业创新发展高峰论坛”将于2018年11月29日-30日在珠海国际会展中心隆重举办!
中国集成电路设计业2018年会暨
珠海集成电路产业创新发展高峰论坛
CSIA-ICCAD 2018 Annual Conference &
Zhuhai IC Industry Innovation and Development Summit
会议日程
Agenda
2018年11月29日,星期四
Nov. 29,Thursday, 2018
地点:珠海国际会展中心四楼珠海厅
Venue:Zhuhai Ballroom,L4,Zhuhai International Convention & Exhibition Center
时间 Time |
内容 Contents |
开幕式 Opening Ceremony |
|
主持人:珠海市副市长芦晓凤女士 Moderator: Ms. Xiaofeng Lu, Vice Mayor,Zhuhai |
|
08:30-09:00 |
中国半导体行业协会领导致词 Address, CSIA |
领导嘉宾致辞 Address, Leader and Guest |
|
珠海市领导致辞 Address, Zhuhai |
|
09:00-09:10 |
重大项目签约仪式 The Signing Ceremony of Major Projects |
高峰论坛 Top Forum |
|
主持人:中国半导体行业协会集成电路设计分会秘书长程晋格先生 Moderator: Mr. Jinge Cheng, General Secretary, CSIA-ICCAD |
|
09:10-09:40 |
迎接设计业的难得发展机遇 —中国半导体行业协会集成电路设计分会理事长魏少军教授 Welcoming the New Development Opportunity —Prof. Shaojun Wei, General Director, CSIA-ICCAD |
09:40-10:00 |
为何半导体行业内的设计不断加快? —Dr. Walden.C. Rhines, CEO Emeritus of Mentor, a Siemens business Why Is Semiconductor Industry Design Activity Accelerating? —Dr. Walden.C. Rhines, CEO Emeritus of Mentor, a Siemens business |
10:00-10:20 |
AI&5G驱动令人兴奋的新时代 —台积电(中国)副总经理陈平博士 —An Exciting Time for IC Industry - AI & 5G Powered Opportunities —Dr. Peter Chen, Vice President, TSMC China Business Development |
10:20-10:40 |
AI如何落地? —芯原控股有限公司董事长兼总裁戴伟民博士 How to Make AI Real? —Dr. Wayne Dai, Chairman, President and CEO, VeriSilicon Holdings Co., Ltd. |
10:40-11:00 |
MachineLearning,引领你改变历史,预见EDA未来 —Cadence公司全球副总裁,亚太及日本区总裁石丰瑜先生 MachineLearning, Defining History, Leading Future of EDA —Mr. Michael Shih, Corporate Vice President, Asia Pacific and Japan, Cadence Design Systems, Inc. |
11:00-11:20 |
从芯片到软件推动产业链融合与创新 —新思科技中国区副总经理王礼宾先生 From Silicon to Software -- Driving the Integration and Innovation of Industry Supply Chain —Mr. Alex Wang, Deputy Country Manager, Synopsys China |
11:20-11:40 |
利用半导体为第四代工业革命创造未来 —三星电子资深副总裁 朴宰弘博士 Creating the Future with Silicon for the 4thIndustrial Revolution —Ph. D. Jaehong Park, SVP, Head of Foundry Design Service Team, Samsung Foundry |
11:40-12:00 |
面向无处不在的AI:可重构神经网络计算架构 —清华大学微电子所副所长尹首一博士 Towards Deploying AI Everywhere: High Energy Efficient NN Computing Architecture —Dr. Shouyi Yin, Deputy Director, Institute of Microelectronics, Tsinghua University |
12:00-13:25 |
自助午餐Buffet Lunch |
主持人:中国半导体行业协会IC设计分会 副理事长黄学良先生 Moderator: Mr. Xueliang Huang, Vice General Director, CSIA-ICCAD |
|
13:25-13:30 |
幸运抽奖Lucky Draw |
13:30-13:50 |
专注于制造当地化的晶圆代工服务 —和舰芯片制造(苏州)股份有限公司副总经理林伟圣先生 Local Manufacture Focus Foundry —Mr. W S Lin, VP, Hejian Technology (Suzhou) Co., Ltd. |
13:50-14:10 |
需求导向,专业服务,推动集成电路产业发展 —国家专用集成电路系统工程技术研究中心主任时龙兴教授 Demand Oriented, Professional Services, to Promote the Development of IC Industry —Prof. Longxing Shi, Director, National ASIC system Engineering Research Centre |
14:10-14:30 |
打造新型差异化晶圆厂 —格芯副总裁兼大中华区总经理白农先生 Building a New Breed of Differentiated Foundry —Mr. Wallace Pai, VP & General Manager, GlobalFoundries |
14:30-14:50 |
打造智能科技生态,共创万亿智能互联 —安谋科技(中国)执行董事长兼首席执行官吴雄昂先生 BuildingThe Ecosystem of Intelligent Future —Mr. AllenWu, Executive Chairman & CEO, Arm Technology (China) |
14:50-15:10 |
创新是国产EDA发展的唯一道路 —华大九天副总经理栾昌海先生 Innovation is the Only Way for Domestic EDA —Mr. Adward Luan, VP, Empyrean |
1//www.58yuanyou.com5:10-15:30 |
芯片制造推动创新变革 —上海华力微电子有限公司市场部部长杨展悌博士 IC Manufacturing Drive the Innovation and Change —Ph.D James Yang, Marketing Director, HLMC |
15:30-15:45 |
茶歇,交流 Coffee Break |
15:45-15:50 |
幸运抽奖 Lucky Draw |
15:50-16:10 |
SiFive引领半导体设计革命 —SiFive全球CEO Naveed Sherwani博士 SiFive – Leading Semiconductor Design Revolution —Dr. Naveed Sherwani,CEO,SiFive |
16:10-16:30 |
嵌入式非挥发存储器在汽车电子浪潮中的机遇与挑战 —成都锐成芯微科技股份有限公司CEO 向建军先生 Opportunities and Challenges of Embedded non Volatile Memory in Automotive Electronic Wave —Mr. Jianjun Xiang, CEO, Chengdu Analog Circuit Technology Inc. |
16:30-16:50 |
用于物联网、大数据、人工智能、自动驾驶等领域,为SoC设计迅速占领市场提供的EDA和IP —Sivaco CEO David L. Dutton先生 EDA and IP for Fast Time to Market SoC Design in IoT, Big Data, AI and Autonomous Driving —Mr. DavidL.Dutton, CEO, Silvaco,Inc. |
16:50-17:10 |
十年再造一个TI —摩尔精英CEO 张竞扬先生 Build a New “TI” in 10 Years —Mr. JY Zhang, Chairman & CEO, MooreElite |
17:10-17:30 |
由SoC开启的万物智联时代 —索喜科技(上海)有限公司董事长兼总经理铃木寿哉 The AIoT World Made by SoC —Mr. Toshiya Suzuki, Chairman & President, Socionext Technology (Shanghai) Co., Ltd. |
17:30-17:35 |
幸运抽奖 Lucky Draw |
19:00-21:00 |
欢迎晚宴(Mentor公司赞助) Welcome Dinner Banquet (Sponsored by Mentor) 地点:珠海国际会展中心珠海厅 Site:Zhuhai Ballroom, 4F,Zhuhai International Convention & Exhibition Center |
2018年11月30日,星期五
Nov. 30, Friday, 2018
专题论坛(一)
SubjectForum (Ⅰ)
地点:珠海国际会展中心四楼珠海厅5
Venue:Zhuhai Hall 5, L4, Zhuhai International Convention & Exhibition Center
时间 Time |
内容 Contents |
演讲人 Lecturer |
|
EDA与IC设计服务 EDA and IC Design Service |
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主持人:中国半导体行业协会集成电路设计分会副理事长,周生明先生 Moderator: Mr. Shengming Zhou, Vice General Director, CSIA-ICCAD |
|||
08:40-09:00 |
将人工智能嵌入芯片设计 Bringing Artificial Intelligence to Chip Design |
关逸基,新思科技中国区技术应用总监 Kenny Kwan, Director, Application Engineering, Synopsys China |
|
09:00-09:20 |
AI芯片设计以及验证的挑战 Success to AI Chips Modeling and Verification |
梁戈超, Cadence系统验证产品线技术支持经理 Jordan Liang, Cadence Solution AE Manager of System Verification Group |
|
09:20-09:40 |
人工智能快速开发流程:从HLS到硬件加速器,加速你的设计周期 AI Quick Deployment Flow: HLS to Emulation Speed up Your Design Cycle |
张俊, 明导电子资深技术经理 Justin Zhang, Senior AEManager, Mentor, A Siemens Business |
|
09:40-10:00 |
基于22FDX的蓝牙5.0和NB-IoT片上系统 22FDX Based, Integrated BLE5.0 and NB-IoT SoC Solution |
曾毅,芯原微电子(上海)有限公司IoT平台总监 Yi Zeng, Director, IoT Platform, VeriSilicon Microelectronics (Shanghai) Co., Ltd. |
|
10:00-10:20 |
加速先进工艺的电路仿真验证 Accelerate Circuit Simulation and Validation on Advanced Process |
董森华,华大九天副总经理 Senhua Dong, VP, Empyrean Software Co., Ltd. |
|
10:20-10:40 |
浅析公共技术服务平台对IC企业集聚的促进作用 Analysison Relationship between Public Technology Service Platform and IC Enterprises Aggregation |
李辉,南京集成电路产业服务中心(南京ICC)平台总监(公共技术服务平台、系统应用服务平台总监) HuiLi, Director, Nanjing IC Industry Service Center (ICisC) PublicTechnology Service Platform Director & System Application Service Platform |
|
10:40-11:00 |
使用Silvaco cell工具进行标准单元库版图的迁移和优化 Layout Migration and Optimization with Silv//www.58yuanyou.comaco’s Cello |
刘客,芯师(上海)电子科技有限公司AE经理 Ke Liu, AE Manager, SilvacoChina., Ltd. |
|
11:00-11:20 |
怎样解决IC、封装和系统设计的建模与仿真挑战 Addressing Modeling and Simulation Challenges for IC, Package and System |
代文亮,苏州芯禾电子科技有限公司创始人、工程副总裁 Wenliang Dai,Founder,VP Engineering,Xpeedic Technology |
|
11:20-11:40 |
基于HBM2 IP与CoWoS封装适合人工智能、超算与高速通信的高性能ASIC设计方法 High Performance ASIC Design Methodology for AI, HPC and Networking Based on HBM2 IP and CoWoS Package |
陈宏铭博士,创意电子股份有限公司华东区业务总监 Dr. Arthur Hung-Ming Chen, East China Regional Sales Director, Global Unichip Corporation |
|
11:40-12:00 |
创造芯片协同设计新价值—ASIC设计服务 ASIC: Design Enablement for Semiconductor Mega Trend & Evolution |
赖荣兴,智原科技营销协理 Raymond Lai, Marketing & Investment AVP, Faraday Technology |
|
12:00-12:05 |
幸运抽奖 Lucky Draw |
||
12:05-13:30 |
自助午餐 Buffet Lunch |
||
主持人:中国半导体行业协会集成电路设计分会副秘书长,韩乐福先生 Moderator: Mr. Lefu Han, Vice General Secretary, CSIA-ICCAD |
|||
13:30-13:50 |
异构计算下的FPGA发展 Heterogeneous Compute Driving FPGA Innovation |
王海力,京微齐力(北京)科技有限公司CEO Haili Wang, CEO, Hercules Microelectronics Co., Ltd. |
|
13:50-14:10 |
查找高性能SOC中电磁串扰问题 Finding Aggressors in High Performance SOC’s |
ThomasFlynn, Helic副总裁 Thomas Flynn, Vice President, Helic |
|
14:10-14:30 |
设计服务的创新 Innovation in Design Service |
庄志青,灿芯半导体(上海)有限公司首席执行官 John Zhuang, CEO, Brite Semiconductor (Shanghai) Corporation |
|
14:30-14:50 |
支持嵌入式智能的物联网处理器平台 Embedded intelligent data processor for IoT Application |
陈岚博士,中国科学院EDA中心主任 Dr.Lan Chen, Director, EDA Center of Chinese Academy of Sciences |
|
14:50-15:10 |
在Gigachip设计上的一种创新时序收敛方法,借助Tweaker ECO平台,实现在数百scenario中高效的runtime和内存消耗 A Novel Methodology of Timing Closure for Gigachip Design having hundreds of Scenarios simultaneously with effective Runtime & Memory using Tweaker ECO Platform |
林仕洲,知亿科技股份有限公司资深技术总监 Joe Lin, Senior Director, Dorado Design Automation, Inc. |
|
15:10-15:30 |
ICO----智能设计平台以更少资源赢得投片时间和质量 ICO - Extremely Smart Design Methodology to Accomplish Shocking Turn-Around Time and Quality |
和王峰,南京科拉德电子技术有限公司技术副总 Aaron He,CTO, Nanjing Cloud Electronic Technology Co., Ltd. |
|
15:30-15:50 |
茶歇,交流Coffee Break |
||
15:50-16:10 |
硅知识产权保护方法与策略 Silicon Intellectual Property Protection Methods and Strategies |
石子信,北京芯愿景软件技术有限公司副总经理 Tony Shi, VP, Cellixsoft Corporation |
|
16:10-16:30 |
《再谈APPRY》 The Critical Role of APPRY in SoC Design |
谷建餘,无锡华大国奇科技有限公司CEO Jianyu Gu, CEO, Qualchip Technologies, Inc. |
|
16:30-16:50 |
面向先进IC设计的器件建模和电路仿真解决方案 Addressing Modeling and Simulation Challenges for Fabless IC Design Companies |
吴伟雄,概伦电子科技有限公司高级市场总监 Weixiong Wu, Sr. Product Marketing Director, ProPlus Design Solutions, Inc. |
|
16:50-17:10 |
半导体和电子产业的机遇与挑战 Semiconductor and Electronics: Opportunities and Challenges |
张书强,ANSYS中国半导体事业部AE经理 Shuqiang Zhang, AE Manager, SCBU of ANSYS Inc. |
|
17:10-17:30 |
EasyECO:大幅加快设计流程的自动化ECO工具 EasyECO: An Intelligence Enhanced Functional ECO Tool to Largely Speed up the Design Flow |
魏星,香港奇捷科技股份有限公司CTO Xing Wei, CTO, Hong Kong Easy-Logic Technology Limited |
|
17:30-17:35 |
幸运抽奖 Lucky Draw |
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18:00-20:00 |
闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点:珠海国际会展中心十字门厅 Site:Shizimen Hall,Zhuhai International Convention & Exhibition Center |
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2018年11月30日,星期五
Nov. 30, Friday, 2018
专题论坛(二)
Subject Forum (II)
地点:珠海国际会展中心四楼珠海厅4
Venue: Zhuhai Hall 4, L4,ZhuhaiInternational Convention & Exhibition Center
时间 Time |
内容 Contents |
演讲人 Lecturer |
IP与IC设计(一) IP and IC Design (I) |
||
主持人:中国半导体行业协会集成电路设计分会副理事长,张力天先生 Moderator: Mr. Litian Zhang, Vice General Director, CSIA-ICCAD |
||
08:40-09:00 |
补足IC行业短板谋求创新发展 新形势下思考本土CPU企业前行道路 |
傅城博士,上海兆芯集成电路有限公司副总裁 Dr. Cheng Fu, VP, Shanghai Zhaoxin Semiconductor Co., Ltd. |
09:00-09:20 |
中国架构,全球生态—人工智能平台周易 Chinese Architecture, GlobalEcosystem - AI Platform Zhouyi |
刘澍,安谋科技(中国)产品研发副总裁 Shu Liu, VP of Product Development, Arm China |
09:20-09:40 |
以完整的IP解决方案迎接下一代AI和ADAS芯片设计挑战 DesignWare IP Solutions for AI and Automotive SoC Design |
钟香建,新思科技华南区IP销售总监 Xiangjian Zhong,South China IP Sales Manager, Synopsys |
09:40-10:00 |
SiFive基于RISC-V架构的CPU发展蓝图 SiFive RISC-V Product Overview |
Jack Kang, SiFive产品副总裁 Jack Kang, VP of Product, SiFive |
10:00-10:20 |
ADAS系统高性能SoC的设计挑战 Challenges of building high performance ADAS SoC |
刘晖,索喜科技(上海)有限公司高端定制SoC事业部亚太区总经理 Kenn Liu, General Manager of Advanced Custom SoC Division, Socionext Technology (Shanghai) Co., Ltd. |
10:20-10:40 |
台积电OIP,设计流程和设计实现 TSMC OIP, Reference Flow and Design Enablement |
任建军,台积电 George Ren, TSMC |
10:40-11:00 |
Visual Plus SLAM专用芯片赋能机器人产业 Visual Plus SLAM ASIC Empowers the RobotIndustry |
姜新桥,珠海市一微半导体有限公司市场营销副总 Tina Jiang, VicePresident of Marketing, Amicro Semiconductor Co., Ltd. |
11:00-11:20 |
开启智能语音新纪元 A New Ear of Intelligent Voice |
劳懋元,杭州中天微系统有限公司中天微智能语音平台负责人 Patrick Lao, Sr. Manager, C-SKY Microsystem |
11:20-11:40 |
专为前端深度学习设计的AI处理器 A Specialized AI Processor for Deep-Learning Inference at the Edge |
柴卫华,CEVA中国市场拓展经理 Bobby Chai,MarketingManager , CEVA China |
11:40-12:00 |
面向新环境下提供客户ASIC IP/SOC整体设计及解决方案 Providing ASIC IP/SOC Overall Design and Solution to Customers Under New Circumstances |
谭飞鸿,广州思信电子科技有限公司CEO Feihong Tan, CEO, Guangzhou Sytrons Technology Co.,Ltd. 徐立文,广州思信电子科技有限公司项目总监 Liwen Xu, Project Director,Guangzhou Sytrons Technology Co., Ltd. |
12:00-12:05 |
幸运抽奖Lucky Draw |
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12:05-13:30 |
自助午餐Buffet Lunch |
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主持人:中国半导体行业协会集成电路设计分会副秘书长,徐秀法先生 Moderator: Mr. Xiufa Xu, Vice General Secretary, CSIA-ICCAD |
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13:30-13:50 |
Imagination先进视觉无损压缩技术 Visually Lossless Compression |
郑凯,Imagination Technologies中国区解决方案技术经理 Kai Zheng, Solutions Engineering Manager, Imagination Technologies |
13:50-14:10 |
先进设计方法:系统层级架构探索与高阶综合 Advanced Design Methodology: System-level Architecture Exploration & High Level Synthesis |
李俊德,宏太科技股份有限公司技术经理 Elvis Li, Technical Manager, Avant Technology Inc. |
14:10-14:30 |
AndesCore™ V5 CPU Families迎接智能物联世代 Embracing the AIoT Era with AndesCore™ V5 CPU Families |
王胜雯,晶心科技市场及技术服务处处长 Wen Wang, Director of Marketing and Technical Service Division, Andes Technology |
14:30-14:50 |
PCIe 5.0将会在未来的SoC里普及化吗? WillPCIe 5.0 become ubiquitous in tomorrow’s SoCs? |
Rex Yu, Field Application Engineer, Support and Applications, PLDA Inc. |
14:50-15:10 |
保卫万物智联:国产高安全IP和安全方案 Protect IoT with OSR Security IP and Solutions |
樊俊锋,深圳市纽创信安科技开发有限公司CEO Junfeng Fan, CEO, Open Security Research, Inc. |
15:10-15:30 |
在7nm和5nm FinFET工艺上开发物联网和微功率产品的时钟系统 Developing Clocking Systemfor IoT and Micropower Products in 7nm and 5nm FinFET |
Andrew Cole.Silicon Creations副总裁 Andrew Cole, VP, Silicon Creations |
15:30-15:50 |
茶歇,交流Coffee Break |
|
15:50-16:10 |
USB3 –推动未来百亿元的产业机遇 USB3 - Driving the Next Billion Dollar Opportunity |
卢笙,芯启源公司董事长&首席执行官 Sheng Lu, Chairman and CEO, Corigine Inc. |
16:10-16:30 |
在基于ARM CPU的SoC芯片中集成嵌入式FPGA Integrating an Embedded FPGA IP into Your ARM-Based SoC |
郭道正,Achronix半导体公司中国区销售总监 Dawson Guo, Sales Director of China, Achronix Semiconductor Corporation |
16:30-16:50 |
利用软硬件协同验证平台加速SSD主控芯片设计 Accelerate SSD Controller Development via Software-hardware Synergistic Platform |
王时,北京忆芯科技有限公司SSD架构师 Shi Wang, Architect, SSD Design, Beijing StarblazeTechnologyCo., Ltd. |
16:50-17:10 |
防逆向工程伪装技术—保护你的集成电路设计 Silicon Camouflage Technology - Why would you need to protect an Integrated Circuit? |
Ron Cocchi,法商颖设科技有限公司CTO Ron Cocchi,Chief Technology Officer, Inside Secure |
17:10-17:15 |
幸运抽奖 Lucky Draw |
|
18:00-20:00 |
闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点:珠海国际会展中心十字门厅 Site: Shizimen Hall,Zhuhai International Convention & Exhibition Center |
2018年11月30日,星期五
Nov. 30, Friday, 2018
专题论坛(三)
Subject Forum (III)
地点:珠海国际会展中心四楼珠海厅7
Venue:Zhuhai Hall 7,L4,ZhuhaiInternational Convention & Exhibition Center
时间 Time |
内容 Contents |
演讲人 Lecturer |
FOUNDRY与工艺技术 Foundry and Process Technology |
||
主持人:中国半导体行业协会集成电路设计分会副理事长,李永华先生 Moderator: Mr. Yang Liu, Vice General Director, CSIA-ICCAD |
||
08:40-09:00 |
台积电N7/N7+/N12/N22技术平台 TSMC N7/N7+/N12/N22 Design Enablement Platforms |
韩晓峰,台积电技术支持经理 Evan Han, Technical Support Manager, TSMC |
09:00-09:20 |
利用FDSOI推动差异化解决方案以应对日益严苛的市场需求 Driving Differentiated Solutions with FD-SOI for Demanding Markets |
韩志勇,格芯中国区销售总经理 Zhiyong Han, China Sales General //www.58yuanyou.comManager, Globalfoundries |
09:20-09:40 |
先进特色工艺与前沿应用创新 Advanced Specialty Technologies For Leading Edge Applications |
于德洵,联华电子股份有限公司韩国暨中国销售支援处资深处长 Remi Yu, Senior Director,United Microelectronics Corporation (UMC) |
09:40-10:00 |
全面拥抱智能时代 Preparing for the Age of Intelligence |
魏峥颖,上海华力微电子有限公司副厂长 Raymond Wei,Deputy Senior Director, HLMC |
10:00-10:20 |
芯片初创公司是如何倒下的? How Fabless Startups Fallfrom a Foundry Sales View? |
张竞扬,摩尔精英CEO JY Zhang, Chairman &CEO, MooreElite |
10:20-10:40 |
武汉新芯3D IC技术平台——后摩尔时代的设计新思路 XMC 3D IC Platform - New Design View in the Post-Moore Era |
孙鹏,武汉新芯集成电路制造有限公司运营中心副总裁 Holly Sun, VP of Operation Center, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. |
10:40-11:00 |
汇聚“芯”动力,打造“芯”生态 Tap Chip Potential to Create a Chip Ecosystem |
胡湘俊,上海华虹宏力半导体制造有限公司战略、市场与发展部门部长 Calvin Hu, Director of Strategy, Marketing and Development Division, Shanghai Huahong Grace Semiconductor Manufacturing Corporation |
11:00-11:20 |
65纳米工艺上先进的模拟IC解决方案 Advanced Analog IC Solutions in 65nm Technology |
秦磊,TowerJazz中国区总经理 Lei Qin, China General Manager, TowerJazz |
11:20-11:40 |
华邦专业嵌入式新兴电阻记忆体工艺平台增进创新 Winbond Specialty Embedded Emerging ReRAM Foundry Platform Enables Innovation |
谢明辉博士,华邦电子公司技术总监 Dr. Ming-Huei Shieh, Technology Executive, Winbond |
11:40-12:45 |
幸运抽奖Lucky Draw |
|
12:00-13:30 |
自助午餐Buffet Lunch |
|
IP与IC设计(二) IP and IC Design (II) |
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主持人:中国半导体行业协会集成电路设计分会副秘书长,刘娜女士 Moderator: Ms. Na Liu, Vice General Secretary, CSIA-ICCAD |
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13:30-13:50 |
赛普拉斯半导体先进的电荷陷阱嵌入式闪存 CYPRESS Advanced Charge Trap Embedded Flash |
那炜,赛普拉斯半导体技术(上海)有限公司总监 Wei Na, Director, CYPRESS Semiconductor Technology (Shanghai) Co., Ltd. |
13:50-14:10 |
边缘计算和可编程逻辑器件FPGA Edge Computing and FPGA |
王添平,广东高云半导体科技股份有限公司工程副总裁 TP Wang, VP of Engineering, Gowin Semiconductor Corp. |
14:10-14:30 |
M31万物联网AIoE——引领IP迈向:新智慧、新应用、新纪元 AIoE (AI+IoE)—M31, Leading IPs into the New Eraof Deep Intelligence Applications |
王怀德博士,M31科技公司经理 Huaide Wang, Ph.D.,Technical Manager, M31 Technology Corp. |
14:30-14:50 |
Wave Computing:将AI赋能Mips IP Wave Computing: AI Enables Mips |
熊大鹏,Wave Computing大中国区总经理 Dapeng Xiong,GM, Wave Computing Great China |
14:50-15:10 |
和众之长,芯创蓝海——IPGoal与中小集成电路企业的共荣之道 Together, Create a Harmonious Environment and Grow along with Customers. |
邹铮贤,四川和芯微电子股份有限公司董事长兼CEO Jackie Zou, Chairman of the Board & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd. |
15:10-15:30 |
集创显示芯科技,打造高清屏时代 ChiponeDisplay IC Technology to Create a High-definition Screen Era |
陆婉民,北京集创北方科技股份有限公司市场战略副总裁 Jason Lu,Vice President of Strategic Marketing, ChiponeTechnology (Beijing) Co., Ltd. |
15:30-15:50 |
茶歇,交流Coffee Break |
|
15:50-16:10 |
集成电路IP共享 Integrated Circuit IPSharing |
辛卫华,中科院微电子研究所信息中心主任 Weihua Xin, Director ofInformation Center, Institute of Microelectronics of Chinese Academy of Sciences |
16:10-16:30 |
ImplementingISO 26262 Compliant AI Systems with Arm and Arteris IP |
葛礼鹏,Arteris IP 资深架构师 Gary Ge, Senior Solution Architect, Arteris IP |
16:30-16:50 |
尖端工艺节点上的高度定制化IP解决方案 Highly Customized IP So原由网lution in 28/14/10nm |
何颖,芯动科技有限公司FAE总监 Huck He, FAE Director, Innosilicon Technology Ltd. |
16:50-17:10 |
智能物连网--嵌入式根密钥解决方案与芯片防盗拷技术 NeoPUF Embedded Root of Trust Solution and Chip Anti-clone Applications for AIoT |
柳星舟,力旺电子股份有限公司市场发展部项目经理 Emory Liu, Product Portfolio Manager of Market Development Department, eMemory |
17:10-17:30 |
最优存储器解决方案 Optimal Memory Solution |
范煜川,爱普存储技术(杭州)有限公司设计与系统验证工程部经理 Eric Fan, FAE Director, AP Memory Technology (Hangzhou) Limited Co. |
17:30-17:35 |
幸运抽奖Lucky Draw |
|
18:00-20:00 |
闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点:珠海国际会展中心十字门厅 Site: Shizimen Hall,Zhuhai International Convention & Exhibition Center |
2018年11月30日,星期五
Nov. 30, Friday, 2018
专题论坛(四)
Subject Forum (IV)
地点:珠海国际会展中心四楼珠海厅1
Venue: Zhuhai Hall 1, L4,ZhuhaiInternational Convention & Exhibition Center
时间 Time |
内容 Contents |
演讲人 Lecturer |
原由网
先进封装与测试 Advanced Packaging and Testing |
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主持人:中国半导体行业协会集成电路设计分会副秘书长,李军先生 Moderator: Mr. Jun Li, Vice General Secretary, CSIA-ICCAD |
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08:40-09:00 |
通富微电的功率半导体封装技术发展与挑战 The Development and Challenge of Power Packaging in TFME |
林伟,通富微电子股份有限公司技术中心副总 Wayne Lin, Vice President, R&D Center, TFME |
09:00-09:20 |
半导体全产业链大数据应用新业态 Innovative Big Data Application in Semiconductor Full Supply Chain |
蓝碧健,普迪飞半导体业务拓展总监 Rebecca Lan, Business Development Director, PDFSolutions |
09:20-09:40 |
一站式ATE测试平台 One-Stop ATE Test Platform |
潘津,苏州华兴源创科技股份有限公司CTO Jin Pan, CTO, Suzhou HYC Technology Co., LTD |
09:40-10:00 |
先进封装技术发展趋势 Development Trend of Advanced IC Packaging |
梁新夫,江苏长电科技股份有发公司高级副总裁 Steve Liang,Ph.D, Senior Vice President, JCET |
10:00-10:20 |
物联网的系统级封装平台解决方案 SiP Solution Platform for IoT |
郑民耀,日月光集团处长 Eddie Cheng, Director, ASE Group |
10:20-10:40 |
先进封装对环氧塑封料的性能要求 Performance Requirements of Epoxy Molding Compound for Advanced IC Package |
王善学,北京科化新材料科技有限公司运营总监,科化新材料泰州有限公司总经理 Shanxue Wang, COO of Beijing KEHUA, GM of KEHUA Taizhou |
10:40-11:00 |
晶圆级倒装先进封装装备及其核心技术国产化 Introduction of A Made-in-China Wafer Level Flip-chip Advanced Packaging Machine and Its Core Technologies |
贺云波教授,广东工业大学微电子装备与技术教育部重点实验室 Prof. Yunbo He,Guangdong University of Technology |
11:00-11:20 |
人工智能辅助汽车电子芯片测试技术从A+提升至A++等级 Automotive with AI (A&A) Motivate Test Technologies from A+ to A++ level |
刘安炫,京隆科技(苏州)有限公司/京元集团总经理 Anhsuan Liu, President, King long Technology (Suzhou) Co., Ltd. (KLT) /KYEC Group |
11:20-11:40 |
测量“芯”的脉动 Measure the"pulse" of a Chipset |
郑纪峰, 是德科技(中国)有限公司大中华区市场总经理 Jifeng Zheng, General Manager, Greater China Marketing,Keysight Technologies |
11:40-12:00 |
晶圆级封装技术发展与展望 Advanced WLP Technology Development |
郭谦,中芯长电半导体(江阴)有限公司资深经理 Chien Kuo, Senior Manager, SJ Semiconductor(Jiangyin) Corp. |
12:00-12:05 |
幸运抽奖Lucky Draw |
|
12:05-13:30 |
自助午餐Buffet Lunch |
|
主持人:中国半导体行业协会集成电路设计分会副秘书长,赵建忠教授 Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD |
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13:30-13:50 |
台积电工艺平台概要 Overview of TSMC Technology Platforms |
刘坚斌,台积电客户经理 Armstrong Liu, Account Manager, TSMC |
13:50-14:10 |
高性能异构芯片集成封装- 2.5D封装和HDFO Advanced Heterogeneous Packaging Solutions - 2.5D Package and HDFO |
李吕祝,安靠科技资深总监 John Lee, Sr. Director, Amkor Technology, Inc. |
14:10-14:30 |
先进系统级封装趋势及应用 Advanced System Integration Package Technology Trends & Application |
于大全,华天科技(昆山)有限公司副总经理 Daquan Yu, VP, Hua Tian Technology(kuanshan) Co., Ltd. |
14:30-14:50 |
未来封装解决方案展望 “All In One" Package - Package Solution for the Future |
袁虹,奥特斯(中国)有限公司前端工程部总监 Rainbow Yuan, Front-End Engineering Director, AT&S(China)Co., Ltd. |
14:50-15:10 |
系统级封装进化 SiP Technology Evolution |
蔡瀛洲,台中硅品精密公司处长 Jensen Tsai, Director, Siliconware Precision Industries Co., Ltd. |
15:10-15:30 |
划时代的在线存储器测试暨修复工具- START Innovated SRAM BIST/BISR Solution– START |
张容诚,厚翼科技股份有限公司中国区销售总监 Michael Chang, Sales Director of China Region, HOY Technologies Co., Ltd. |
15:30-15:50 |
茶歇,交流Coffee Break |
|
15:50-16:10 |
人工智能时代的芯片测试解决方案 Testing Solution for Artificial Intelligence Devices |
徐琨,爱德万测试(中国)管理有限公司系统支持部专家工程师 Kun Xu,Expert Engineer of System Engineering Department, Advantest (China) Co., Ltd. |
16:10-16:30 |
射频IC芯片测试 Radio Frequency ICTesting Solution |
甘秉鸿,罗德与施瓦茨(中国)科技有限公司资深产品应用专家 BinghongGan, Product Specialist,Rohde & Schwarz (China) Technology Co., Ltd. |
16:30-16:35 |
幸运抽奖Lucky Draw |
|
18:00-20:00 |
闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点:珠海国际会展中心十字门厅 Site: Shizimen Hall,Zhuhai International Convention & Exhibition Center |
2018年11月30日,星期五
Nov. 30, Friday, 2018
专题论坛(五)
Subject Forum (V)
地点:珠海国际会展中心四楼珠海厅2
Venue:Zhuhai Hall 2, L4,ZhuhaiInternational Convention & Exhibition Center
时间 Time |
内容 Contents |
演讲人 Lecturer |
珠海集成电路创新创业发展论坛 Zhuhai IC Innovation and Entrepreneurship Forum |
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主持人:珠海市科技工业和信息化局副局长刘嘉先生 Moderator: Mr. Jia Liu, Deputy Director,Zhuhai Science and Technology and Industrialization Information Bureau |
||
09:00-09:05 |
介绍嘉宾 Introduce Guests |
|
09:05-09:35 |
致辞 Speech |
魏少军教授,中国半导体行业协会集成电路设计分会理事长 Prof. Shaojun Wei, General Director, CSIA-ICCAD |
09:35-09:55 |
珠海市集成电路产业发展环境介绍 Introduction to the Development Environment of Zhuhai IC Industry |
贺军,珠海市科技工业和信息化局局长 Jun He, Director, Zhuhai Science and Technology and Industrialization Information Bureau |
09:55-10:25 |
澳门大学集成电路国家重点实验室技术创新之路 The Road to TechnologicalInnovation of the State-Key Laboratory of Analog and Mixed-Signal VLSI (AMSV) ofthe University of Macau |
麦沛然教授,模拟与混合信号超大规模集成电路国家重点实验室副主任(澳门大学) Prof. Pui-In Mak, Universityof Macau |
10:25-10:45 |
中国芯助力国产打印机快速发展 China Core Helps ChineseDomestic Printer Develop Rapidly |
丁励,珠海艾派克微电子有限公司CTO兼副总经理 Li Ding, CTO, Apex Microelectronics Co., Ltd. |
10:45-11:05 |
大湾区智能终端与IC产业整合发展新机遇 New Opportunities of Intelligent Device Manufacturing and IC Industry Cooperative Development in the Great Bay Area |
张启明,珠海市杰理科技股份有限公司副总经理、技术总监 Qiming Zhang,Vice-general manager、CTO,Zhuhai Jieli Technology Co.,Ltd. |
11:05-11:25 |
格力电器集成电路发展情况 Integrated Circuit Current Status and Development Trend of Gree |
李绍斌,珠海格力电器股份有限公司总裁助理 Shaobin Li, Assistant President GREE ELECTRIC APPLIANCES,INC. OF ZHUHAI |
11:25-11:45 |
我们如何看待半导体行业在大湾区的发展前景 How to View the Development Prospects of the Semiconductor Industry in the Great Bay Area |
陈源远,珠海华金创新投资有限公司执行董事 Yuanyuan Cheng,Executive Director, Zhuhai Huajin Innovation Investment Co., Ltd. |
11:45-11:50 12:00-13:30 |
幸运抽奖 Lucky Draw 自助午餐 Buffet Lunch |
|
资本与IC设计业 Capital and IC Design Industry |
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主持人:石溪资本合伙人,中国半导体行业协会集成电路设计分会副秘书长,孙坚女士 Moderator: Ms. Jian Sun, Vice General Secretary, CSIA-ICCAD |
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13:30-13:50 |
砥砺前行,还看今朝——深耕中国半导体产业20年 Keep Forging ahead, in the Best Now - Deeply Root and Developin China IC Industry for over 20 Years |
黄庆博士,华登国际董事总经理 Dr. Hing Wong, Managing Director(MD), Walden International |
13:50-14:10 |
新形势下对中国集成电路产业发展及投资的思考 Thoughts on the Development and Investment of China's IC Industry Under the New Situation |
孙玉望,中芯聚源股权投资管理(上海)有限公司创始合伙人&总裁 Yuwang Sun, Partner & President, China Fortune-Tech Capital Co., Ltd. |
14:10-14:30 |
集成电路设计业投资机会分析 Analysis of Investment Opportunities in IC Design Industry |
孙加兴,国新风险投资管理(深圳)有限公司执行董事 Jacky Sun,Executive Director,China Reform Venture Investment Management (Shenzhen) Ltd. |
自由研讨—IPO、企业并购和商业经营,产业发展缺一不可的路径 Panel – IPO, M & A and Business Operation, Integral Industry Development Way |
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14:30-15:30 |
研讨嘉宾:陈大同、孙玉望、高松涛、黄庆、孙加兴等 中国半导体行业经历了3年令人兴奋的投资高潮和良好的市场发展;时至今日,中美贸易摩擦“高烧”未退,产品市场需求增长乏力,资本市场一级二级趋于倒挂;面对资金来源、技术交流和市场发展多重不利因素的影响,我们集成电路设计行业、产业界和投资界正在思考如何应对挑战。 Honored Guests:Dr. Datong Chen, Mr. Yuwang Sun, Mr. Songtao Gao, Dr. Hing Wong, Mr. Jiaxing Sun, etc. China semiconductor industry has been experiencing 3 years' exciting investment boom and promising market development. Nowadays, the Sino-US trade frictions high fever still notdown, the product market demand weak to grow, the primary and secondary capital markets upside down; Facing the multiple unfavorable factors influence including capital resource, technology communication and market development, weIC design industry and investors are considering how to face the challenges. |
|
芯片奥林匹克IEEE国际固态电路峰会ISSCC 2019中国发布会-最新IC设计技术趋势 “Chip Olympic” - IEEE ISSCC 2019 China Press Conference – Technical Trends of IC Design |
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主持人:ISSCC国际技术委员会中国区代表,余成斌教授,IEEE会士 Moderator: Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative |
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15:30-15:50 |
注册 Registration |
|
15:50-16:00 |
芯片奥林匹克IEEE国际固态电路峰会ISSCC 2019简介 Introduction of Chip Olympic IEEE ISSCC 2019 |
李泰成教授,ISSCC国际技术委员会远东区主席,台湾大学 Prof. Tai-Cheng Lee, ISSCC 2018 ITPC Far East Chair, Taiwan University |
16:00-16:10 |
ISSCC 2019远东区的技术趋势 Far East Technical Trends for ISSCC 2019 |
高宮真教授,ISSCC国际技术委员会远东区副主席,日本东京大学 Prof. Makoto Takamiya, ISSCC ITPC Far East Vice-Chair, Univ. of Tokyo |
16:10-16:20 |
ISSCC 2019中国区入选论文和发展趋势 ISSCC 2019 China Papers and Trends |
余成斌教授,IEEE会士,ISSCC国际技术委员会委员及中国区代表,澳门大学和新诺普思澳门 Prof. Seng-Pan (Ben) U, IEEE Fellow, ISSCC ITPC China Country Representative, Univ. of Macau and Synopsys Macau |
ISSCC2019峰会设计领域论文亮点和点评 —ISSCC2019国际技术委员会委员 ISSCC2019 Subcommittee Paper Highlights —ISSCC2019 International Technical Program Committee (ITPC) Member |
||
电源管理 Power Management |
洪志良教授,复旦大学Prof. Zhiliang Hong, FudanUniversity |
|
模拟电路 Analog |
罗文基副教授,澳门大学 Prof.Man-Kay Law,Univ. of Macau |
|
数据转换器 Data Converters |
余成斌教授,澳门大学和新诺普思澳门 Prof. Seng-Pan (Ben) U, Univ. of Macau and Synopsys Macau |
|
数字架构和系统/数字电路 Digital Architecture & System/ Digital Circuits |
高宮真教授,日本东京大学 Prof. Makoto Takamiya, Univ. ofTokyo |
|
无线通讯/射频电路 Wireless / RF |
Howard Luong教授,香港科技大学 Prof. Howard Luong, HK Univ. ofS&T |
|
有线通讯 Wireline |
李泰成教授,台湾大学 Prof. Tai-Cheng Lee, TaiwanUniversit |
|
存储器/图像, MEMS,医疗和显示 Memory / Imagers, MEMS, Medical& Displays (IMMD) |
Dr. Long Yan,韩国三星电子 Dr. Long Yan, SamsungElectronics |
|
前瞻技术领域 Technology Directions |
麦沛然教授,澳门大学 Prof. Pui-In Mak, University of Macau |
|
17:30-17:50 |
问答讨论和合影 Q&A,Group Photo |
|
18:00-20:00 |
闭幕晚宴及交旗仪式 Closing Banquet and Flag Handover Ceremony 地点:珠海国际会展中心十字门厅 Site:Shizimen Hall, Zhuhai International Convention & Exhibition Center |
会议日程以最终现场公布为准。
Agendaup to final siterelease.